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Update actions products
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kaklik authored and github-actions[bot] committed Jul 21, 2024
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42,819 changes: 20,219 additions & 22,600 deletions doc/gen/LION2CELL02-Fuel Gauge.svg
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49,378 changes: 24,702 additions & 24,676 deletions doc/gen/LION2CELL02-Power Input.svg
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5,306 changes: 2,778 additions & 2,528 deletions doc/gen/LION2CELL02-Power Output.svg
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5,474 changes: 3,113 additions & 2,361 deletions doc/gen/LION2CELL02-schematic.svg
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840 changes: 406 additions & 434 deletions doc/gen/LION2CELL02.brd

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80,594 changes: 42,069 additions & 38,525 deletions doc/gen/LION2CELL02.step

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55 changes: 41 additions & 14 deletions doc/gen/README.md
Original file line number Diff line number Diff line change
Expand Up @@ -5,7 +5,7 @@ Board size: 80.77x60.45 mm (3.18x2.38 inches)
- This is the size of the rectangle that contains the board
- Thickness: 1.6 mm (63 mils)
- Material: FR4
- Finish: HAL
- Finish: None
- Layers: 2
- Copper thickness: 35 µm

Expand All @@ -18,26 +18,39 @@ Silk screen: TOP / BOTTOM
- Color: White


Stackup:

| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | | | | | |
| F.Mask | Top Solder Mask | | 10 | | | |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | core | | 1510 | FR4 | 4.5 | 0.020 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | | 10 | | | |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | | | | | |

# Important sizes

Clearance: 0.2 mm (8 mils)

Track width: N/A mm (N/A mils)
Track width: 0.2 mm (8 mils)

- By design rules: 0.2 mm (8 mils)

Drill: 0.3 mm (12 mils)

- Vias: N/A mm (N/A mils) [Design: 0.4 mm (16 mils)]
- Vias: 0.5 mm (20 mils) [Design: 0.4 mm (16 mils)]
- Pads: 0.3 mm (12 mils)
- The above values are real drill sizes, they add 0.1 mm (4 mils) to plated holes (PTH)

Via: N/A/N/A mm (N/A/N/A mils)
Via: 0.8/0.4 mm (31/16 mils)

- By design rules: 0.4/0.3 mm (16/12 mils)
- Micro via: yes [0.2/0.1 mm (8/4 mils)]
- Buried/blind via: yes
- Total: 0 (thru: 0 buried/blind: 0 micro: 0)
- Total: 52 (thru: 52 buried/blind: 0 micro: 0)

Outer Annular Ring: 0.1 mm (4 mils)

Expand All @@ -51,44 +64,58 @@ Eurocircuits class: 6D

Components count: (SMD/THT)

- Top: 4/15 (SMD + THT)
- Bottom: 72/1 (SMD + THT)
- Top: 2/17 (SMD + THT)
- Bottom: 69/0 (SMD)

Defined tracks:

- 0.2 mm (8 mils)
- 0.25 mm (10 mils)
- 0.3 mm (12 mils)
- 0.4 mm (16 mils)
- 0.5 mm (20 mils)
- 0.6 mm (24 mils)
- 0.8 mm (31 mils)
- 0.86 mm (34 mils)

Used tracks:

- 0.2 mm (8 mils) (597) defined: yes
- 0.3 mm (12 mils) (3) defined: yes
- 0.5 mm (20 mils) (32) defined: yes
- 0.8 mm (31 mils) (29) defined: yes

Defined vias:


Used vias:

- 0.8/0.4 mm (31/16 mils) (Count: 52, Aspect: 2.0 A) defined: no

Holes (excluding vias):

- 0.2 mm (8 mils) (4)
- 0.2 mm (8 mils) (1)
- 0.65 mm (26 mils) (2)
- 0.89 mm (35 mils) (26)
- 1.0 mm (39 mils) (8)
- 1.3 mm (51 mils) (8)
- 1.6 mm (63 mils) (4)
- 2.7 mm (106 mils) (6)
- 3.0 mm (118 mils) (4)

Oval holes:

- 0.5x0.9 mm (20x35 mils) (4)
- 0.6x1.4 mm (24x55 mils) (2)
- 0.6x1.7 mm (24x67 mils) (2)

Drill tools (including vias and computing adjusts and rounding):

- 0.3 mm (12 mils) (4)
- 0.6 mm (24 mils) (4)
- 0.3 mm (12 mils) (1)
- 0.5 mm (20 mils) (52)
- 0.65 mm (26 mils) (2)
- 0.7 mm (28 mils) (4)
- 1.0 mm (39 mils) (26)
- 1.1 mm (43 mils) (8)
- 1.4 mm (55 mils) (8)
- 1.7 mm (67 mils) (4)
- 2.7 mm (106 mils) (6)
Expand All @@ -103,9 +130,9 @@ The stencil thickness is 0.12 mm.

| Side | Pads with paste | Area [mm²] | Paste [g] |
|--------|-----------------|------------|-----------|
| Top | 14 | 17.38 | 0.09 |
| Bottom | 223 | 266.57 | 1.33 |
| Total | 237 | 283.95 | 1.41 |
| Top | 4 | 5.51 | 0.03 |
| Bottom | 214 | 257.19 | 1.28 |
| Total | 218 | 262.70 | 1.31 |

Note: this is just an approximation to the theoretical value. Margins of the solder mask and waste aren't computed.

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218 changes: 0 additions & 218 deletions doc/gen/dxf/LION2CELL02-B_Adhesive.dxf

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